Electronic Parts : K4H1G0838M-LB3

Fabricant : SAMSUNG[Samsung semiconductor]

D'emballage :

Pins :

Description : M-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

Température : Min °C | Max °C

Datasheet : K4H1G0838M-LB3 PDF

• K4H1G0838A
• K4H1G0838A-TCA0
• K4H1G0838A-TCA2
• K4H1G0838A-TCB0
• K4H1G0838A-TLA0
• K4H1G0838A-TLA2
• K4H1G0838A-TLB0
• K4H1G0838A-UC/LA2
• K4H1G0838A-UC/LB3
• K4H1G0838A-UC/LCC
• K4H1G0838A-UCLA2
• K4H1G0838A-UCLB3
• K4H1G0838A-UCLCC
• K4H1G0838AUC/LB0
• K4H1G0838AUCLB0