Electronic Parts : MR18R1624AF1-CN9

Fabricant : Samsung semiconductor

D'emballage :

Pins :

Description : (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

Température : Min °C | Max °C

Datasheet : MR18R1624AF1-CN9 PDF

• MR18R1624AF0
• MR18R1624AF0-CK8
• MR18R1624AF0-CM8
• MR18R1624AF1-CN9
• MR18R1624AF1-CT9