Electronic Parts : MR18R326GAG0

Fabricant : SAMSUNG[Samsung semiconductor]

D'emballage :

Pins :

Description : (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

Température : Min °C | Max °C

Datasheet : MR18R326GAG0 PDF

• MR18R326GAG0
• MR18R326GAG0-CM8
• MR18R326GAG0-CT9